Analysis of thermal resistance structure of single-chip LEDs using transient thermal resistance measurement method

Chen-I Chao; Wei-Keng Lin; H. Paul Wang; Shao-Wen Chen; Pen-Cheng Wang; Kuo-Hsiang Chien

Journal article

Analysis of thermal resistance structure of single-chip LEDs using transient thermal resistance measurement method

Chen-I Chao, Wei-Keng Lin, H. Paul Wang, Shao-Wen Chen, Pen-Cheng Wang and Kuo-Hsiang Chien

Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao, Vol.34(6), pp.527-537

2013

Abstract

Junction temperature

Light-emitting diodes

Thermal resistance structure

The study used the theoretical basis of the transient thermal resistance measurement method to establish an LED thermal resistance measurement system. The Transient Thermal Resistance Structure Analysis (TTRS Analysis) software designed and developed for this study was used to analyze its internal structure in order to establish the overall thermal resistance structure of the LED. When comparing the results to the theoretical value, it was found that the error values were kept to within 10%, indicating extremely high repeatability of the measurement results.

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Title: Analysis of thermal resistance structure of single-chip LEDs using transient thermal resistance measurement method
Creators - without role: Chen-I Chao - National Tsing Hua University
Wei-Keng Lin - Department of Engineering and System Science, National Tsing-Hua University
H. Paul Wang - National Cheng Kung University
Shao-Wen Chen - Department of Engineering and System Science, National Tsing-Hua University
Pen-Cheng Wang - Department of Engineering and System Science, National Tsing-Hua University
Kuo-Hsiang Chien - Green Energy and Environment Research Laboratory, ITRI
Identifiers: 9957772212606774
Academic Unit: Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University; Department of Engineering and System Science, College of Nuclear Science, National Tsing Hua University; National Tsing Hua University
Language: English
Resource Type: Journal article
Publication Details: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao, Vol.34(6), pp.527-537

Analysis of thermal resistance structure of single-chip LEDs using transient thermal resistance measurement method

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