摘要
A modified local heating procedure is presented that reduces the sheet resistance of silicon wafers used as heating regions. The temperature-dropping gradient is improved obviously with our novel microheater during micromolding. In comparison with the nonsteady diffusion model, secondary ion mass spectrometry (SIMS) measurements show better agreement of nonsteady diffusion model at high temperature than at low temperature. Fine polymer microstructures can be obtained effectively by our micromolding process using a novel microheater.