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Atomic-layer-deposited Hf O2 on In0.53 Ga0.47 As: Passivation and energy-band parameters
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Atomic-layer-deposited Hf O2 on In0.53 Ga0.47 As: Passivation and energy-band parameters

Y.C. Chang, M.L. Huang, K.Y. Lee, Y.J. Lee, T.D. Lin, M. Hong, J. Kwo, T.S. Lay, C.C. Liao and K.Y. Cheng
Applied Physics Letters, Vol.92(7), 072901
2008

Abstract

Atomic-layer-deposited high κ dielectric Hf O2 films on air-exposed In0.53 Ga0.47 AsInP (100), using Hf (NC H3 C2 H5)4 and H2 O as the precursors, were found to have an atomically sharp interface free of arsenic oxides, an important aspect for Fermi level unpinning. A careful and thorough probing, using high-resolution angular-resolved x-ray photoelectron spectroscopy (XPS) with synchrotron radiation, however, observed the existence of Ga2 O3, In2 O3, and In (OH)3 at the interface. The current transport of the metal-oxide- semiconductor capacitor for an oxide 7.8 nm thick follows the Fowler-Nordheim tunneling mechanism and shows a low leakage current density of ∼ 10-8 A cm2 at VFB +1 V. Well behaved frequency-varying capacitance-voltage curves were measured and an interfacial density of states of 2× 1012 cm-2 eV-1 was derived. A conduction-band offset of 1.8±0.1 eV and a valence-band offset of 2.9±0.1 eV have been determined using the current transport data and XPS, respectively. © 2008 American Institute of Physics.
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