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Atomic-level investigation of the growth of Si/Ge by ultrahigh vacuum chemical vapor deposition
Journal article   Peer reviewed

Atomic-level investigation of the growth of Si/Ge by ultrahigh vacuum chemical vapor deposition

D.-S. Lin, T. Miller and T.-C. Chiang
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol.15(3), pp.919-926
05/1997

Abstract

Si and Ge films can be prepared under ultrahigh vacuum conditions by chemical vapor deposition using disilane and digermane as source gases. These gases offer a high sticking probability, and are suitable for atomic layer epitaxy. Using synchrotron radiation photoemission spectroscopy and scanning tunneling microscopy, we have examined the surface processes associated with the heteroepitaxial growth of Ge/Si. The measured surface-induced shifts and chemical shifts of the Si 2p and Ge 3d core levels allow us to identify the surface species and to determine the surface chemical composition, and this information is correlated with the atomic features observed by scanning tunneling microscopy. Issues related to precursor dissociation, attachment to dangling bonds, diffusion, surface segregation, growth morphology, and pyrolytic reaction pathways will be discussed. © 1997 American Vacuum Society.

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