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Bulk micromachining fabrication platform using the integration of DRIE and wet anisotropic etching
Journal article   Peer reviewed

Bulk micromachining fabrication platform using the integration of DRIE and wet anisotropic etching

Huai-Yuan Chu and Weileun Fang
Microsystem Technologies, Vol.11(2-3), pp.141-150
2005

Abstract

Bulk micromachining DRIE Wet anisotropic etching
This study presents a bulk micromachining fabrication platform on the (100) single crystal silicon substrate. The fabrication platform has employed the concept of vertical corner compensation structure and protecting structure to integrate the wet anisotropic etching and DRIE processes. Based on the characteristics of wet anisotropic etching and DRIE, various MEMS components are demonstrated using the bulk micromachining platform. For instance, the free suspended thin film structures and inclined structures formed by the {111} crystal planes are fabricated by the wet etching. On the other hand, the mesas and cavities with arbitrary shapes and the structures with different leve l heights (or depths) are realized by the characteristics of DRIE. Since the aforementioned structures can be fabricated and integrated using the presented fabrication platform, the applications of the bulk micromachining processes will significantly increase. © Springer-Verlag 2005.

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