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Challenges and Trends of SRAM-Based Computing-In-Memory for AI Edge Devices
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Challenges and Trends of SRAM-Based Computing-In-Memory for AI Edge Devices

Chuan-Jia Jhang, Cheng-Xin Xue, Je-Min Hung, Fu-Chun ChangMeng-Fan Chang
IEEE Transactions on Circuits and Systems I: Regular Papers
2021

摘要

Arrays Artificial intelligence Artificial intelligence (AI) Common Information Model (computing) Computer architecture computing-in-memory (CIM) edge computation Internet of Things (IoT) Microprocessors Performance evaluation SRAM cells static random access memory (SRAM). Electrical and Electronic Engineering
When applied to artificial intelligence edge devices, the conventionally von Neumann computing architecture imposes numerous challenges (e.g., improving the energy efficiency), due to the memory-wall bottleneck involving the frequent movement of data between the memory and the processing elements (PE). Computing-in-memory (CIM) is a promising candidate approach to breaking through this so-called memory wall bottleneck. SRAM cells provide unlimited endurance and compatibility with state-of-the-art logic processes. This paper outlines the background, trends, and challenges involved in the further development of SRAM-CIM macros. This paper also reviews recent silicon-verified SRAM-CIM macros designed for logic and multiplication-accumulation (MAC) operations.

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