Chipping-Induced Fracture Investigation of Glass Interposer with Dielectric Coatings

期刊文章

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J.-C. Chuang, 昌駿李, C.-H. Lee 和 H.-C. Cheng

Surface and Coatings Technology, 卷.489

08/2024

摘要

Glass interposer;Finite element analysis (FEA);Fracture mechanics

1 檢視次數

題名: Chipping-Induced Fracture Investigation of Glass Interposer with Dielectric Coatings
創作者：: J.-C. Chuang (作者) - National Tsing Hua University
昌駿李 (作者)
C.-H. Lee (作者) - National Tsing Hua University
H.-C. Cheng (作者) - National Tsing Hua University
學術資源類型: 期刊文章
出版日期: 08/2024
出版資訊: Surface and Coatings Technology, 卷.489
語言: 英語