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Conductive microcapsules for self-healing electric circuits
期刊文章

Conductive microcapsules for self-healing electric circuits

G.W. Lai, S.J. Chang, J.T. Lee, H. LiuC.C. Li
RSC Advances, 卷.5(126), 頁碼.104145-104148
12/2015

摘要

Chemistry (all) Chemical Engineering (all)
Conductive microcapsules that are compatible with inorganic-based materials such as Ag conductive paste for casting electric circuits are prepared. These conductive microcapsules show high efficiency, more than 80% within 30 s, for the restoration of an interrupted circuit that presented a cracking width of about 150 μm.

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