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Conjugate heat transfer analysis of sidewall-heated rectangular microchannels with different bottom wall materials
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Conjugate heat transfer analysis of sidewall-heated rectangular microchannels with different bottom wall materials

Chun-Sheng Wang, Hong-Yi Yu, Chih-Yung HuangTong-Miin Liou
International Journal of Heat and Mass Transfer, 卷.221, 125094
04/2024

摘要

3D Simulation Axial conduction Conjugate heat transfer Micro-PIV Microchannel TSP Condensed Matter Physics Mechanical Engineering Fluid Flow and Transfer Processes
In this study, the conjugate heat transfer in a microchannel under four sidewalls (left, right, top, and bottom wall facing upstream) heating conditions is investigated experimentally and numerically. The microchannel has a width of 500 μm and a depth of 100 μm. Micro-Particle Image Velocimetry (Micro-PIV) and Temperature Sensitive Paint (TSP) are respectively applied to measure the velocity and temperature fields at a Reynolds number (Re) of 20. The experimental results demonstrate that the temperature gradient exists in both the left, right, and bottom wall, indicating the existence of conjugate heat transfer. Thus, 3D conjugate heat transfer simulations are subsequently conducted. Good agreements are attained between numerical and experimental data only with the non-ideal boundary condition. Otherwise, there is a significant discrepancy between them. Further parametric studies on bottom wall to fluid thermal conductivity ratio (k b /k f ) and Re show that the fully developed overall Nusselt number (Nu‾) in the conjugate heat transfer case is approximately 4.55, much higher than the analytical solution 0.87 without accounting for conjugate heat transfer. As k b /k f is varied from 0.21 to 6.48, there exists a critical k b /k f =1.79, before and beyond which the total heat flux respectively increases and decreases with k b /k f . However, Nu‾ is a monotonically increasing function of k b /k f , with a peak value of 5.75 occurring at k b /k f = 6.48.

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