摘要
In a chiplet IC, several dice are integrated through die-to-die interconnects. Technical challenges still exist for the repair of these die-to-die interconnects to boost the overall manufacturing yield. In this work, we propose a novel Connectivity-Agnostic Built-In Self-Repair (BISR) scheme for chiplet ICs. In our scheme, the design-for-BISR circuit inserted in each functional die except the master die is independent of the die-to-die connectivity so that a nonmaster die can be repeatedly reused in many chiplet ICs while supporting in-the-field repair of faulty interconnects to boost the manufacturing yield and in-the-field reliability.