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Crystallization behaviors and microhardness of sputtered Ni-P, Ni-P-Cr and Ni-P-W deposits on tool steel
Journal article   Open access   Peer reviewed

Crystallization behaviors and microhardness of sputtered Ni-P, Ni-P-Cr and Ni-P-W deposits on tool steel

Wei-Yu Chen, Shih-Kang Tien, Fan-Bean Wu and Jenq-Gong Duh
Surface and Coatings Technology, Vol.182(1), pp.85-91
01/04/2004

Abstract

Differential thermal analysis Microhardness Ni-P-based deposit RF sputter Strengthening mechanism Thermal stability
The Ni-P-based coatings, including binary Ni-P, ternary Ni-P-Cr and Ni-P-W, were fabricated by the RF magnetron sputtering technique with dual target of electroless Ni-P alloy and a third metal element. To evaluate the influence of the doping element in Ni-P deposit, differential scanning calorimeter (DSC) analysis was employed to characterize the temperature of phase transformation. The phase transition during thermal evolution under heat-treatment was analyzed by X-ray diffractometry (XRD). Crystallization behavior in binary and ternary Ni-P-based coatings was quite distinct due to the addition of Cr and W. Microhardness tests indicated that the sputtered Ni-P-Cr and Ni-P-W coatings exhibited superior hardness and excellent thermal stability than the Ni-P coating. In addition, chromium exhibited compatible thermal characteristics with the tungsten for the ternary Ni-P-based system. The strengthening mechanism in the sputtered Ni-P-Cr and Ni-P-W deposits is also discussed. © 2003 Elsevier B.V. All rights reserved.
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