Design, Fabrication and Analysis of WIT wafer Level Packaging

Journal article

Engineering Science & Technology Bulletin Engineering Science & Technology Bulletin, pp.18-21

2004

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Title: Design, Fabrication and Analysis of WIT wafer Level Packaging
Creators - without role: K. N Chiang - 國立清華大學工學院動力機械工程學系
Identifiers: 9957776750006774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Journal article
Publication Details: Engineering Science & Technology Bulletin Engineering Science & Technology Bulletin, pp.18-21