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Design and characterization of single-layer step-bridge structure for out-of-plane thermal actuator
Journal article   Peer reviewed

Design and characterization of single-layer step-bridge structure for out-of-plane thermal actuator

Wen-Chih Chen, Po-I Yeh, Chih-Fan Hu and Weileun Fang
Journal of Microelectromechanical Systems, Vol.17(1), pp.70-77
02/2008

Abstract

Buckling Microelectromechanical systems (MEMS) Step-bridge Thermal actuator
This paper presents the design and fabrication of a single-layer out-of-plane thermal actuator. The step-bridge structure design enables bending and then buckling of the actuator in the out-of-plane direction by Joule heating. Moreover, the moving direction of the actuator can be specified by the step structure. In summary, the step-bridge actuator design has the following five merits: 1) The load-deflection relation is easily tuned; 2) the bistable buckling behavior is prevented; 3) the unwanted vibration modes can be suppressed; 4) the delamination problem is prevented; and 5) the bridge structure is stiffer and more stable. The actuator and its application on a lens positioning stage have been implemented using p ++ Si layer by bulk micromachining. It demonstrates that a typical actuator would move upward with an amplitude near 13 μm when driven at 54 mW. © 2008 IEEE.

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