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Design and fabrication of a miniaturized bulk acoustic filter by high aspect ratio etching
Journal article   Peer reviewed

Design and fabrication of a miniaturized bulk acoustic filter by high aspect ratio etching

Chung-Hsien Lin, Hong-Ren Chen and Weileun Fang
Journal of Microlithography, Microfabrication and Microsystems, Vol.4(3), 033010
07/2005

Abstract

Bulk acoustic device Inductive coupling plasma MEMS resonator
A 2.45-GHz filter is fabricated by thin film bulk acoustic wave resonator (FBAR) technology. It is designed to minimize die size and simplify the fabrication process simultaneously by using inductive coupling plasma etching. The quality factor of a fabricated single resonator is 1567 and the electromechanical coupling coefficient is 5.7%. The fabricated filter has minimum insertion loss around 1.5 dB and maximum insertion loss at 3.6 dB in 83.5-MHz bandwidth, which is suitable for WLAN and Bluetooth applications. © 2005 Society of Photo-Optical Instrumentation Engineers.

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