摘要
Efficient thermal management is crucial for high-performance electronic devices, motivating the development of advanced heat sink designs. This study investigates a three-layer composite heat sink consisting of an AlSi10Mg base, a 316L stainless steel interlayer and a carbon layer, aimed at enhancing heat dissipation and reducing interfacial thermal resistance. A three-dimensional chessboard-pattern heat sink was modeled and analyzed using numerical simulations, solving the steady-state mass, momentum and energy conservation equations. Parametric studies evaluated the effects of pillar height, cross-sectional size, pitch, pore diameter and top perforation on airflow and thermal performance. The optimized triple-layer composite lowers the maximum working temperature from 49.4 to 37.5 degrees C, achieving a 24% improvement. The optimal design consists of pillars 50 mm high with a 5 x 5 mm(2) cross-section, 1 mm pitch and 1 mm perforation diameter. Larger pitch and pore diameters improved airflow uniformity and heat transfer, while perforated pillar tops further mitigated localized hot spots. To demonstrate manufacturing feasibility, a single-layer AlSi10Mg heat sink was fabricated using selective laser melting according to the optimized design, providing a foundation for future experimental studies. These findings highlight the effectiveness of multi-layer composite designs and geometric optimization in enhancing thermal management for electronic cooling applications.