摘要
The electrical and processing performance of filler-based silver conductive pastes is primarily determined by system design, integrating
filler architecture, binder chemistry, solvent composition, and additives. Silver particle morphology and distribution play
a critical role in forming continuous conductive networks. Hybrid filler systems - combining micron-sized flakes for bulk packing
with nanosilver or nanowires to bridge interparticle gaps - reduce the percolation threshold and achieve low resistivity without
high-temperature sintering