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Development of CMOS MEMS inductive type tactile sensor with the integration of chrome steel ball force interface
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Development of CMOS MEMS inductive type tactile sensor with the integration of chrome steel ball force interface

Sheng-Kai Yeh, Heng-Chung ChangWeileun Fang
Journal of Micromechanics and Microengineering, 卷.28(4), 044005
02/2018

摘要

CMOS MEMS micro tactile sensor sensing interface Electronic Optical and Magnetic Materials Mechanics of Materials Mechanical Engineering Electrical and Electronic Engineering
This study presents an inductive tactile sensor with a chrome steel ball sensing interface based on the commercially available standard complementary metal-oxide-semiconductor (CMOS) process (the TSMC 0.18 μm 1P6M CMOS process). The tactile senor has a deformable polymer layer as the spring of the device and no fragile suspended thin film structures are required. As a tactile force is applied on the chrome steel ball, the polymer would deform. The distance between the chrome steel ball and the sensing coil would changed. Thus, the tactile force can be detected by the inductance change of the sensing coil. In short, the chrome steel ball acts as a tactile bump as well as the sensing interface. Experimental results show that the proposed inductive tactile sensor has a sensing range of 0-1.4 N with a sensitivity of 9.22(%/N) and nonlinearity of 2%. Preliminary wireless sensing test is also demonstrated. Moreover, the influence of the process and material issues on the sensor performances have also been investigated.

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