Development of a virtual teaching module for advanced semiconductor fabrication and its learning effectiveness analysis

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Jen-Kai Huang, Jen-Chu Shu, Yu-Hsuan Lin, Ting-Yun Chang, Hsin-Yu Jwo, 文華唐和 Chun-Wei Tang

Computer Applications in Engineering Education, 卷.32(6)

2024

摘要

learning effectiveness;packaging and testing;semiconductor manufacturing process;virtual reality;wafer fabrication

url

https://doi.org/10.1002/cae.22802檢視

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題名: Development of a virtual teaching module for advanced semiconductor fabrication and its learning effectiveness analysis
創作者：: Jen-Kai Huang (作者)
Jen-Chu Shu (作者)
Yu-Hsuan Lin (作者)
Ting-Yun Chang (作者)
Hsin-Yu Jwo (作者)
文華唐 (作者)
Chun-Wei Tang (作者)
學術資源類型: 期刊文章
出版日期: 2024
出版資訊: Computer Applications in Engineering Education, 卷.32(6)
語言: 英語