Abstract
The double-channel ridge waveguide (DCRW) laser diode is investigated to determine its die-bonding conditions and thermal dissipation capability. Two different bonding facilities are employed when doing die-bonding to verify if pre-vacuumed environment is helpful for good die-bonding. Scanning electron microscopy is used to determine the condition of the interface between laser diode and heatsink. From the measured group behavior of thermal resistance, it is noted that poor die bonding lead to rapid increase in thermal resistance and ineffective heat dissipation occur when heat is transported to heat sinks.