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Dynamical growth behavior of copper clusters during electrodeposition
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Dynamical growth behavior of copper clusters during electrodeposition

Pei-Cheng Hsu, Yong Chu, Jae-Mock Yi, Cheng-Liang Wang, Syue-Ren Wu, Y. HwuG. Margaritondo
Applied Physics Letters, 卷.97(3), 033101
07/2010

摘要

Physics and Astronomy (miscellaneous)
Ultrahigh resolution full-field transmission x-ray microscopy enabled us to observe detailed phenomena during the potentiostatic copper electrodeposition on polycrystalline gold. We detected two coexisting cluster populations with different sizes. Their growth behaviors are different, with a shape transitions only occurring for large clusters. These differences influence the micromorphology and general properties of the overlayer. © 2010 American Institute of Physics.

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