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Economic aspects of memory built-in self-repair
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Economic aspects of memory built-in self-repair

Rei-Fu Huang, Chao-Hsun ChenCheng-Wen Wu
IEEE Design and Test of Computers, 卷.24(2), 頁碼.164-172
03/2007

摘要

BIRA BISR BIST Built-in self-repair Economic models Overhead Redundancy analysis Yield Hardware and Architecture
The demand for built-in self-repair (BISR) methodologies that improve the yield of embedded memories is growing. A typical BISR scheme requires circuit modules that perform built-in self-test (BIST), built-in redundancy analysis (BIRA), real-time address remapping, and so on. The objective of BISR design is to maximize the final yield while keeping a reasonably low hardware overhead. In this work, the authors propose cost and benefit models, and evaluate the economic effectiveness of typical memory BISR implementations. They also present a simulator for that purpose based on the proposed cost models. The results are useful for evaluating the BISR schemes and implementations. Experimental results show that memory size impacts the cost-effectiveness of BISR more than production volume does. © 2007 IEEE.

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