摘要
Diamond/Ag/Cu–Ti composites were fabricated by low-cost pressureless sintering with Ti addition to improve the diamond–metal matrix wettability and the effects of Ag/Cu matrix variation on the composites were investigated. Transmission electron microscopy identified the interfacial structure on the diamond (1 0 0) plane of the diamond/Ag/Cu–Ti composite with the 80 at.% Cu matrix as Cu–Ag/TiC/Ag–C/TiC/diamond. The thermal conductivity of the diamond/Ag/Cu–Ti composites was significantly enhanced upon increasing the Ag contents of the Ag/Cu matrix. The 60 vol% diamond/Ag/Cu–2 at.% Ti composite with 40 at.% Cu matrix content exhibited the maximum thermal conductivity of 826 W/m·K and the compatible coefficient of thermal expansion of 6.0 ppm/K. The diamond/Ag/Cu-Ti composites are promising low-cost thermal management materials for electronic device integration.