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Effect of SiH4/CH4 flow ratio on the growth of β-SiC on Si by electron cyclotron resonance chemical vapor deposition at 500°C
Journal article   Peer reviewed

Effect of SiH4/CH4 flow ratio on the growth of β-SiC on Si by electron cyclotron resonance chemical vapor deposition at 500°C

Chih-Chien Liu, Chiapyng Lee, Kuan-Lun Cheng, Huang-Chung Cheng and Tri-Rung Yew
Applied Physics Letters, p.168
1995

Abstract

β-SiC (3C-SiC) films were deposited on silicon substrates by electron cyclotron resonance chemical vapor deposition from SiH 4 /CH 4 /H 2 mixtures at 500°C. The crystalline structure and chemical composition of the deposited film were found to depend on the SiH 4 /CH 4 flow ratio. With a sufficient energy supply from microwave power and a SiH 4 /CH 4 flow ratio of 0.5 and lower, stoichiometric SiC could be deposited on Si substrates. Microcrystalline β-SiC was grown at a SiH 4 /CH 4 flow ratio of 0.5, whereas amorphous SiC was obtained at the SiH 4 /CH 4 flow ratios lower than 0.5. When the SiH 4 /CH 4 flow ratio was above 0.5, only polycrystalline Si could be deposited. © 1995 American Institute of Physics.

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