Abstract
The effect of deposition parameters on the temperature coefficient of resistance of Polycrystalline thin films was studied. A polaron model was used to describe the temperature dependency of the films. The TCR value was found to increase with increase in the activation energy for the polaron hopping. The resistivity, activation energy and TCR value of the films were found to decrease with increase in the oxygen or calcium (Ca) content of the films for the temperature higher than the metal-insulator transition temperature. The TCR value and resistivity were also reduced in large grain films.