Abstract
The effects of CH 4 /SiH 4 flow ratio and microwave power on the formation of SiC at 200 °C by electron cyclotron resonance chemical vapor deposition is investigated. When the CH 4 /SiH 4 flow ratio is varied from 0.5 to 10, crystalline phase of films vary from polycrystalline silicon to polycrystalline β-SiC, and finally to amorphous silicon carbide. However, as the microwave power increases from 300 to 1500 W, the film microstructure changes from polycrystalline Si to amorphous SiC, and finally to polycrystalline β-SiC. The deposition mechanism which controls the film characteristics is also presented. © 2002 Elsevier Science B.V. All rights reserved.