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Electrical Measurement of Submicrometer Contact Holes
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Electrical Measurement of Submicrometer Contact Holes

B.J. Lin, J.A. Underhill, D.L. SundlingB.B. Peck
IEEE Transactions on Semiconductor Manufacturing, 卷.2(3), 頁碼.76-81
1989

摘要

Electronic Optical and Magnetic Materials Condensed Matter Physics Industrial and Manufacturing Engineering Electrical and Electronic Engineering
A special technique to electrically measure submicrometer isolated features is described. By incorporating a large number of features in a single test structure, a gain in precision of better than 3 nm can be shown analytically. The interpreted contact hole diameter as well as the area of the isolated features were found to be accurate when compared with physical measurements using a scanning electron microscope. The special test pattern, an analytic expression for interpretation of the results, and hole size data from a variety of exposure dosages are included. © 1989 IEEE

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