摘要
Printing technology is one of the promising patterning techniques in flexible electronic devices due to its low cost and large-area patternability. In this study, the electromigration (EM) behavior of printed interconnects composed of silver nanoparticles was investigated under a current density of 1.5 x 10(5) A/cm(2) at ambient temperature of 150 degrees C. During the EM test, the morphologies of silver nanoparticles changed as a result of the decrease in the cross-section of the interconnect and the increase in Joule heating generated under high current density. Once the temperature at the cathode of printed interconnects was higher than 350 degrees C, the aggregation and grain growth of Ag nanoparticles began to occur. The Ag particles formed an island-like morphology and the connection among the Ag nanoparticles was completely broken, leading to the loss of their electrical conductivity and open-circuit failures of the printed interconnects at the cathode side.