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Electromigration effects upon the Sn/Ni-7 wt % v interfacial reactions
Journal article   Open access   Peer reviewed

Electromigration effects upon the Sn/Ni-7 wt % v interfacial reactions

Chih-Chi Chen, Sinn-Wen Chen and Chih-Horng Chang
Journal of Applied Physics, Vol.103(6), 063518
2008

Abstract

The electromigration effects upon the SnNi-7 wt % V interfacial reactions are examined. A ternary T phase was formed in the SnNi-7 wt % V couple reacted at 200 °C in the early stage. The reaction phases became T Ni3 Sn4 and an interesting T Ni3 Sn4 T Ni3 Sn4 alternating layer structure with longer reaction time. The passage of electric current of 500 A cm2 density through the couple alters the reaction rates and the phase progression time. At the interface with electrons flow concurrently to the diffusion of Sn atoms, the reaction rates are enhanced. © 2008 American Institute of Physics.
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https://doi.org/10.1063/1.2899956View
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