摘要
Two types of conductive microcapsules with a median size of less than 5 μm are proposed, and their high potential as a key functional material for self-restorable conductive pastes for applications in printed electronic circuits is verified. A well-dispersed suspension of carbon nanoparticles in toluene is prepared as the core material of the microcapsules. The restoration capabilities of the microcapsules for the physical structure and electrical conductivity of silver-based electronic circuit lines are compared. In the assessment of the microcapsule restoration efficiency, the two conductive microcapsules exhibit distinct capabilities for the restoration of damages caused by different mechanical fracturing. That is, the smaller microcapsule is more effective than the larger one to restore circuit lines from a tensile test, whereas the opposite result is obtained from a scratching test, demonstrating the significance of microcapsule size for the restoration of dissimilar fractures that may occur in various applications.