摘要
Despite being strong with many outstanding physical properties, tungsten is inherently brittle at room temperature, restricting its structural and functional applications at small scales. Here, a facile strategy has been adopted, to introduce high-density dislocations while reducing grain boundaries, through electron backscatter diffraction (EBSD)-guided microfabrication of cold-drawn bulk tungsten wires. The designed tungsten microwire attains an ultralarge uniform tensile elongation of ~10.6%, while retains a high yield strength of ~2.4 GPa. in situ TEM tensile testing reveals that the large uniform elongation of tungsten microwires originates from the motion of pre-existing high-density dislocations, while the subsequent ductile fracture is attributed to crack-tip plasticity and the inhibition of grain boundary cracking. This work demonstrates the application potential of tungsten microcomponents with superior ductility and workability for micro/nanoscale mechanical, electronic, and energy systems.