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Enhancement of Oxide Break-Up by Implantation of Fluorine in Poly-Si Emitter Contacted p+ -n Shallow Junction Formation
Journal article   Peer reviewed

Enhancement of Oxide Break-Up by Implantation of Fluorine in Poly-Si Emitter Contacted p+ -n Shallow Junction Formation

Shye Lin Wu, Chung Len Lee, Tan Fu Lei, C.F. Chen, L.J. Chen, K.Z. Ho and Y.C. Ling
IEEE Electron Device Letters, Vol.15(4), pp.120-122
1994

Abstract

Electronic Optical and Magnetic Materials Electrical and Electronic Engineering
In this study, it is demonstrated that the incorporation of fluorine can enhance poly-Si/Si interfacial oxide break-up in the poly-Si emitter contacted p+-n shallow junction formation. The annealing temperature for breaking up the poly-Si/Si interfacial oxide has been found to be as low as 900°C. As a result, the junction depth of the BF2-implanted device is much larger than that of the boron-implanted device.

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