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Enlarging a post-lithography pattern modification process window with a Poisson's ratio-matching inter-layer
Journal article   Peer reviewed

Enlarging a post-lithography pattern modification process window with a Poisson's ratio-matching inter-layer

En-Chiang Chang, Michal Stach, Chung-Yuan Yang, Chien-Chung Fu and Cheng-Yao Lo
Microelectronic Engineering, Vol.127, pp.97-101
05/09/2014

Abstract

Crack onset strain (COS) Extinction ratio Poisson's ratio Post-lithography Stress Wire grid polarizer (WGP)
This study improved the post-lithography pattern dimension modification technique (based on an inorganic-organic multiple layer system) by introducing an inter-layer between the inorganic and organic interface. The Poisson's ratio-matching inter-layer allowed the transfer of more external mechanical stress from the organic substrate to the inorganic structure, rather than resulting in damages, such as cracks and delamination because of material mismatch. The successful stress transfer delayed the occurrence of crack onset strain (COS) of the inorganic material, and enlarged the operation window of the mechanical stress-controlled post-lithography technique. A tunable wire-grid polarizer (WGP) was used to prove the experiment and its changeable optical extinction ratio (ER) and demonstrated the benefit of introducing an inter-layer. Cracks that occurred after the onset of COS were carefully studied to determine whether the simulation model reflected reality. © 2014 Elsevier B.V. All rights reserved.

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