- Title
- Erratum: "Enhancing the reliability of wafer level packaging by using solder joints layout design"(IEEE Transactions on Components and Packaging Technologies)
- Creators - without role
- Chang-Ming Liu - Advanced Microsystem Packaging and Nano-Mechanics Research Laboratory , Advanced Packaging Research Center , National Tsing Hua UniversityChang-Chun Lee - Advanced Microsystem Packaging and Nano-Mechanics Research Laboratory , Advanced Packaging Research Center , National Tsing Hua UniversityKuo-Ning Chiang - Advanced Microsystem Packaging and Nano-Mechanics Research Laboratory , Advanced Packaging Research Center , National Tsing Hua University
- Publication Details
- IEEE Transactions on Components and Packaging Technologies, Vol.30(1), p.190
- Identifiers
- 9957775786406774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- English
- Resource Type
- Journal article
Journal article
Erratum: "Enhancing the reliability of wafer level packaging by using solder joints layout design"(IEEE Transactions on Components and Packaging Technologies)
IEEE Transactions on Components and Packaging Technologies, Vol.30(1), p.190
03/2007
Metrics
1 Record Views