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Erratum to “Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration” (J. Alloys Compd. (2016) 674 (331–340) (S0925838816305771) (10.1016/j.jallcom.2016.03.020))
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Erratum to “Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration” (J. Alloys Compd. (2016) 674 (331–340) (S0925838816305771) (10.1016/j.jallcom.2016.03.020))

Yi-Shan Yang, Chia-Jung Yang 和 Fan-Yi Ouyang
Journal of Alloys and Compounds, 卷.731, 頁.24
01/2018
DOI: https://doi.org/10.1016/j.jallcom.2017.10.008

摘要

Mechanics of Materials Mechanical Engineering Metals and Alloys Materials Chemistry
The publisher regrets that in the above mentioned article, the affiliation of authors is incorrect. The corrected affiliation is “Department of Engineering and System Science, National Tsing Hua University, Hsinchu, 300 Taiwan”. The publisher would like to apologise for any inconvenience caused.

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