- Title
- Eutectic Solder Joint Reliability Analysis of Electronic Packages
- Creators - without role
- K. N Chiang - 國立清華大學工學院動力機械工程學系
- Publication Details
- Electronic Monthly Electronic Monthly, Vol.52, pp.108-116
- Identifiers
- 9957768491006774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Journal article
Journal article
Eutectic Solder Joint Reliability Analysis of Electronic Packages
Electronic Monthly Electronic Monthly, Vol.52, pp.108-116
1999
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