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Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate
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Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate

Bo-Ching He, Chun-Hu Cheng, Hua-Chiang Wen, Yi-Shao Lai, Ping-Feng Yang, Meng-Hung Lin, Wen-Fa WuChang-Pin Chou
Microelectronics Reliability, 卷.50(1), 頁碼.63-69
01/2010

摘要

Electronic Optical and Magnetic Materials Atomic and Molecular Physics and Optics Condensed Matter Physics Safety Risk Reliability and Quality Surfaces Coatings and Films Electrical and Electronic Engineering
In this paper, ultra-high vacuum chemical vapor deposition (UHV/CVD) was employed to synthesize silicon-germanium (SiGe), and sequence to endure annealing treatment. Morphological characterization, roughness, and microstructural morphology were observed by means of scanning electron microscopy (SEM), atomic force microscopy (AFM), and transmission electron microscopy (TEM). The elements distribution, crystallographic, and nanomechanical behavior were carried out using energy-dispersive X-ray spectroscopy (EDS) mapping technique, X-ray diffraction (XRD), and nanoindentation technique. The annealing treated SiGe leads to the 2D germanium segregation on the surface. The phenomenon is interpreted in terms of dislocation-induced structural changes in annealing treatment. Thus, the dislocation propagation in the microstructure was observed. Subsequently hardness and elastic modulus were increased because of a comparatively unstable microstructure after annealing treatment. © 2009 Elsevier Ltd. All rights reserved.

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