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Evolution of the Sn/Ni-8.0 at.%V interfacial reaction paths
Journal article   Peer reviewed

Evolution of the Sn/Ni-8.0 at.%V interfacial reaction paths

Sinn-Wen Chen, Yu-Ren Lin, Hsin-Jay Wu, Ru-Bo Chang, Chia-Ming Hsu and Hong-Ming Lin
Journal of Materials Research, Vol.26(22), pp.2838-2843
28/11/2011

Abstract

Amorphous Microstructure Soldering
Sn/Ni-8.0 at.%V (Ni-7.0 wt%V) couples are prepared and the interfacial reactions at 210 and 250°C are examined. In the early stage of reaction at 250°C, a T phase is formed as a result of fast diffusion of Sn into the Ni-8.0 at.%V substrate. With a longer reaction, the outer region of the T phase transforms to a Ni-depletion layer, which has not been observed previously. Both the T phase and the Ni-depletion layer are analyzed using transmission electronic microscopy. This newly found Ni-depletion layer is composed of Sn and nanosize "VSn2(V 2 Sn 3 )" particulates. The solid/solid reaction paths in the Sn/Ni-8.0 at.%V couples evolve from Sn/T/Ni-V, Sn/Ni 3 Sn 4 /T/Ni-V to Sn/Ni 3 Sn 4 /VSn 2 (V 2 Sn 3 ). During the liquid/solid reactions, the paths are liquid/T/Ni-V, liquid/liquid + Ni3Sn4/T/Ni-V, liquid/liquid + Ni3Sn4/liquid + VSn2(V 2 Sn 3 )/T/Ni-V, and liquid/liquid + Ni3Sn4/liquid + VSn2(V 2 Sn 3 ). © Materials Research Society 2011.

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