Experimental and Simulated Verification of Power Cycling Reliability for Thin and Low Warpage Power Modules

期刊文章

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昌駿李, K.-S. Kao 和 Y.-C. Huang

IEEE Transactions on Power Electronics, 卷.39(10), 頁碼.12478-12489

10/2024

摘要

Finite element analysis;insulated metal substrate;power cycling;power module

1 檢視次數

題名: Experimental and Simulated Verification of Power Cycling Reliability for Thin and Low Warpage Power Modules
創作者：: 昌駿李 (作者)
K.-S. Kao (作者) - National Tsing Hua University
Y.-C. Huang (作者) - National Tsing Hua University
學術資源類型: 期刊文章
出版日期: 10/2024
出版資訊: IEEE Transactions on Power Electronics, 卷.39(10), 頁碼.12478-12489
語言: 英語