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Formation and device application of Ge nanowire heterostructures via rapid thermal annealing
Journal article   Open access   Peer reviewed

Formation and device application of Ge nanowire heterostructures via rapid thermal annealing

Jianshi Tang, Chiu-Yen Wang, Faxian Xiu, Yi Zhou, Lih-Juann Chen and Kang L. Wang
Advances in Materials Science and Engineering, Vol.2011, 316513
2011

Abstract

We reviewed the formation of Ge nanowire heterostructure and its field-effect characteristics by a controlled reaction between a single-crystalline Ge nanowire and Ni contact pads using a facile rapid thermal annealing process. Scanning electron microscopy and transmission electron microscopy demonstrated a wide temperature range of 400∼500C to convert the Ge nanowire to a single-crystalline Ni 2 Ge/Ge/Ni 2 Ge nanowire heterostructure with atomically sharp interfaces. More importantly, we studied the effect of oxide confinement during the formation of nickel germanides in a Ge nanowire. In contrast to the formation of Ni 2 Ge/Ge/Ni 2 Ge nanowire heterostructures, a segment of high-quality epitaxial NiGe was formed between Ni 2 Ge with the confinement of Al 2 O 3 during annealing. A twisted epitaxial growth mode was observed in both two Ge nanowire heterostructures to accommodate the large lattice mismatch in the NixGe/Ge interface. Moreover, we have demonstrated field-effect transistors using the nickel germanide regions as source/drain contacts to the Ge nanowire channel. Our Ge nanowire transistors have shown a high-performance p-type behavior with a high on/off ratio of 10 5 and a field-effect hole mobility of 210cm 2 /Vs, which showed a significant improvement compared with that from unreacted Ge nanowire transistors. Copyright © 2011 Jianshi Tang et al.
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https://doi.org/10.1155/2011/316513View
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