Abstract
Copper interconnects with and without the grounded shielding on the silicon substrate are modeled from 1 to 110 GHz. The fully-analytical model is composed of the cascaded lumped resistor-inductor-conductor-capacitor (RLGC) circuit elements with 20 sections, and featured physical-based, scalable, and frequency-dependent characteristics. An excellent agreement is obtained between the measured, simulated, and modeled S-parameters without any optimization procedure. The proposed approach can be applied for interconnect modeling for integrated-circuits over a wide frequency range. © 2008 The Japan Society of Applied Physics.