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High Speed and Large Memory Window Ferroelectric HfZrO2 FinFET for High-Density Nonvolatile Memory
 

High Speed and Large Memory Window Ferroelectric HfZrO2 FinFET for High-Density Nonvolatile Memory

Siao-Cheng Yan, Guan-Min Lan, Chong-Jhe Sun, Ya-Han Chen, Chen-Han Wu, Hao-Kai Peng, Yu-Hsien Lin, Yung-Hsien Wu Yung-Chun Wu
IEEE Electron Device Letters
2021
Degradation Electric fields FeFET FeFETs ferroelectric memory FinFET FinFETs hafnium zirconium oxide Logic gates Silicon Switches Electronic Optical and Magnetic Materials Electrical and Electronic Engineering
We fabricated the HfZrO2 (HZO) ferroelectric fin field-effect transistors (Fe-FinFET) with fin width of 60 nm and gate length of 100 nm for ferroelectric nonvolatile memory operations. The fabricated Fe-FinFET exhibited a large memory window (MW) at 1.5 V and high (100 ns) program/erase speeds at &null V. After 105 program/erase cycles, the MW was maintained at 1.09 V and the retention time was measured up to 104 s with no degradation. The fabricated HZO Fe-FinFET is compatible with the current FinFET process and has a high MW, a fast program/erase speed, and excellent reliability. Therefore, the fabricated Fe-FinFET is a promising candidate for high-density ferroelectric field-effect transistor memory applications.
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