We fabricated the HfZrO2 (HZO) ferroelectric fin field-effect transistors (Fe-FinFET) with fin width of 60 nm and gate length of 100 nm for ferroelectric nonvolatile memory operations. The fabricated Fe-FinFET exhibited a large memory window (MW) at 1.5 V and high (100 ns) program/erase speeds at &null V. After 105 program/erase cycles, the MW was maintained at 1.09 V and the retention time was measured up to 104 s with no degradation. The fabricated HZO Fe-FinFET is compatible with the current FinFET process and has a high MW, a fast program/erase speed, and excellent reliability. Therefore, the fabricated Fe-FinFET is a promising candidate for high-density ferroelectric field-effect transistor memory applications.
- High Speed and Large Memory Window Ferroelectric HfZrO2 FinFET for High-Density Nonvolatile Memory
- High Speed and Large Memory Window Ferroelectric HfZrO2 FinFET for High-Density Nonvolatile Memory
- Siao-Cheng Yan (Author) - National Tsing Hua UniversityGuan-Min Lan (Author) - National Tsing Hua UniversityChong-Jhe Sun (Author) - National Tsing Hua UniversityYa-Han Chen (Author) - National Tsing Hua UniversityChen-Han Wu (Author) - National Tsing Hua UniversityHao-Kai Peng (Author) - Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan.Yu-Hsien Lin (Author) - National United UniversityYung-Hsien Wu (Author) - Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan.Yung-Chun Wu (Author) - National Tsing Hua University
- IEEE
- Journal article
- 2021
- IEEE Electron Device Letters
- English