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High-performance gate-all-around poly-Si thin-film transistors by microwave annealing with NH3 plasma passivation
Journal article

High-performance gate-all-around poly-Si thin-film transistors by microwave annealing with NH3 plasma passivation

Mu-Shih Yeh, Yao-Jen Lee, Min-Feng Hung, Kuan-Cheng Liu and Yung-Chun Wu
IEEE Transactions on Nanotechnology, Vol.12(4), pp.636-640
2013

Abstract

3-D ICs Microwave annealing (MWA) polycrystalline silicon (poly-Si) rapid thermal annealing (RTA) thin-film transistor (TFT)
This paper introduces nanoscale gate-all-around (GAA) n-MOS polycrystalline silicon thin-film transistors (poly-Si TFTs) by using microwave annealing (MWA). Experimental results of MWA GAA poly-Si TFTs indicate high performances with subthreshold swing (SS) of 105 mV/dec., and I ON /I OFF ratio of 10 7 A/A. MWA reveals sufficient dopant activation efficiency, which is equivalent to rapid thermal annealing. Additionally, the short channel effect is reduced owing to the low-temperature process of MWA and superior gate control of the GAA structure. Moreover, using NH 3 plasma treatment further improves the device mobility, I ON /I OFF ratio, and SS. Importantly, the proposed MWA GAA poly-Si TFT with its high performance and low-temperature process is highly promising for advanced 3-D ICs. © 2002-2012 IEEE.

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