摘要
Normally-off AlGaN/GaN MIS-HEMT devices with multiple fluorinated ALD-Al 2 O 3 layers as the gate dielectric have been reported to achieve a high threshold voltage for normally-off operations with satisfactory performance for both on and off states at room temperature. However, a large swing in gate threshold voltage is found when devices operate at elevated temperatures. Hence, further study of the gate dielectric on the distribution of fluorinated trap states in the energy band are required to assess the gate function at higher temperatures. Through the use of the charge analytical model and Poole-Frenkel trap emission theory, the gate voltage stressing measurement was carried out to accurately find the effective trap state distribution within the Al 2 O 3 energy bandgap created by fluorinated treatments. For the samples fabricated and used in the investigation, we found that a higher population of fluorinated trap states located deeper than 1.1 eV corresponding to emission levels above 200 °C would allow more trapped charges to remain in the dielectric at high temperature for better threshold voltage retention. We also discovered that a higher fluorine treatment power on the gate dielectric could yield a higher trap state density at deeper levels, resulting in better temperature stability.