Abstract
Diamond/Ag-Ti composites were fabricated by a low-cost liquid sintering technique. The Ti addition can effectively improve wetting and promote penetration in composite pores during liquid sintering. The interface structure of the diamond/Ag-Ti composite was identified as Ag/TiC/Ag-Ti/diamond. A high thermal conductivity of 719 W/mK was obtained for the 50 vol.% diamond/Ag-1 at.% Ti composite. Using a bimodal mixture (60 vol.% 150 μm + 10 vol.% 50 μm diamond/Ag-2 at.% Ti composite), a low coefficient of thermal expansion of 6.3 × 10 - 6 /K still with high thermal conductivity of 687 W/mK was achieved. These composites have potential applications for thermal management of high integration electronic devices. © 2014 Elsevier Ltd. All rights reserved.