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Impact of Process-Induced Inclined Side-Walls on Gate Leakage Current of Nanowire GAA MOSFETs
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Impact of Process-Induced Inclined Side-Walls on Gate Leakage Current of Nanowire GAA MOSFETs

Ashraf Maniyar, Pushp Raj, P S T N Srinivas, Arun Kumar, Kuei-Shu Chang-LiaoPramod Kumar Tiwari
IEEE Transactions on Electron Devices
2024

摘要

Fabrication Gallium arsenide Gate leakage Gate leakage gate-all-around metal–oxide semiconductor field-effect transistor (GAA MOSFET) Logic gates measurement MOSFET overlap Semiconductor device modeling trapezoidal (Tz) cross section underlap Voltage measurement Electronic Optical and Magnetic Materials Electrical and Electronic Engineering
In this work, the influence of process-induced sidewall inclination on direct tunneling gate leakage current ( ${ extit{I}}_{{ extit{G}}}$ ) in the trapezoidal (Tz) channel NW GAA MOSFETs has been comprehensively investigated using experimental data and the TCAD simulations results. Variability in device parameters as channel length, height, and width have been taken into account when we examined gate leakage current. The side-wall inclination angle has a significant influence on the gate leakage current, where a rise in ${ extit{I}}_{{ extit{G}}}$ of up to two times is observed when the inclination angle is increased from 0 $^{circ}$ to 20 $^{circ}$ . Moreover, it has also been observed that the direct tunneling gate leakage current is significantly influenced by the gate overlap and underlap areas.

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