Abstract
As the first step of DRAM manufacture, preanneal process plays an important role in determining the threshold voltage variation. It is found that the higher trans-1,2-dichloroethene flow in pad oxide growth and the higher nitrogen flow in high-temperature annealing step would respectively engender a lower boron segregation coefficient and higher nitridation of the oxide, both modify the boron distribution in the substrate and consequently the behavior of the threshold voltage. As the feature size of DRAM devices enter nanometer regime, besides gate oxidation, ion implantation and related thermal processes, the impact of preanneal process condition should be prudentially taken into consideration for rigorous control of the threshold voltage in the advanced DRAM production. © 2008 Elsevier B.V. All rights reserved.