Abstract
It is demonstrated that rapid thermal annealing or laser annealing of Mg-doped GaN (about 0.5 μm in thickness) in general helps activate acceptors and increase the average hole concentration by a factor of about 2 from low to mid of 1017/cm3 determined by the Hall measurements. Use of laser annealing of p-GaN coated with Ni and removal afterwards prior to depositing conventional Ni/Au ohmic-contact films, however, greatly improves the contact resistance from 10-2 to 1.6 × 10-4 Ω cm2. Other heat treatment schemes do not improve as much or make it even worse. The most reduction of contact resistance is attributed to the highest surface hole density in an uneven carrier profile achieved by laser annealing with a Ni cap layer.