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Improved programming and erasing speeds of poly-Si flash memory device by HfO2/Si3N4 bandgap-engineered trapping layer
Journal article   Peer reviewed

Improved programming and erasing speeds of poly-Si flash memory device by HfO2/Si3N4 bandgap-engineered trapping layer

Chun-Yuan Chen, Kuei-Shu Chang-Liao, Hao-Wei Ho and Tien-Ko Wang
Microelectronic Engineering, Vol.109, pp.17-20
2013

Abstract

Bandgap-engineering Flash memory HfO2 Nanowire Poly-Si Si3N 4
Effects of HfO 2 /Si 3 N 4 bandgap-engineered trapping layer (BETL) on poly-Si flash memory device are studied for the first time. Planar and nanowire (NW) channel flash memory devices are successfully fabricated to study the effects of BETL. The programming and erasing speeds can be improved by BETL on both planar and NW channel devices, and the improvement is more obvious on NW channel devices with even a lower operation voltage. The device with BETL and NW channel demonstrates the best programming and erasing speeds due to the electric-field enhancement effect and the band-engineering in charge-trapping layer. It also shows good retention and endurance properties, which makes it promising for 3-D memory integration. © 2013 Elsevier B.V.All rights reserved.

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