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Improving spin-coating process using altered cover design
期刊文章

Improving spin-coating process using altered cover design

C.-M. Cheng 和 R.-H. Chen
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 卷.43(12), 頁碼.8028-8029
2004
DOI: https://doi.org/10.1143/JJAP.43.8028
Web of Science ID: WOS:000226035000023

摘要

Spin coating Thick-film photoresist Work chamber cover Evaporation Flow of fluids Hydrodynamics Microelectromechanical devices Microstructure Photoresists Solvents Surface tension Thick films Viscosity Evaporation rates Gyrset systems Thick-film phororesists Work chamber covers Spin coating
A novel work chamber cover design for a spin coater that can reduce the effect of airflow on spin coating is presented. The experimental results reveal that superior uniformity and film area can be obtained by utilizing the modified design instead of the conventional design.

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https://www.scopus.com/inward/record.uri?eid=2-s2.0-13644273232&doi=10.1143%2fJJAP.43.8028&partnerID=40&md5=42a22443c89df80566426b5b94453d5e檢視
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