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In0.53Ga0.47As FETs with insulator assisted Schottky gates
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In0.53Ga0.47As FETs with insulator assisted Schottky gates

P. O'Connor, T. P. Pearsall, K. Y. Cheng, A. Y. Cho, J. C. M. HwangK. Alavi
IEEE Xplore Digital Library IEEE Electron Device Letters , 卷.3(3), 頁.64
1982

摘要

FETs;Silicon;Epitaxial layers;Leakage current;Molecular beam epitaxial growth;Indium phosphide;Substrates;Plasma chemistry;Plasma devices;Chemical vapor deposition
Schottky-gate FET's have been fabricated on n-type In0.53Ga0.47As using a thin interfacial silicon nitride layer between the metal and the epitaxial layer to reduce the gate leakage current. In0.53Ga0.47As was grown by molecular beam epitaxy on semi-insulating InP substrates and silicon nitride was grown by plasma-enhanced chemical vapor deposition. Devices with 1.2µm gate length and net donor doping in the mid 1016cm-3range show dc transconductance of up to 130mS/mm. Both depletion and enhancement mode operation were observed. The effective saturation velocity of electrons in the channel is deduced to be 2.0 ± 0.5 × 107cm/sec, a value 60 to 70% higher than that in GaAs MESFET's. The insulator-assisted gate technology has many advantages in fabrication flexibility and control compared with other approaches to realizing high-speed microwave and logic in FET's in In0.53Ga0.47As.

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